Specialty Assembler

and procedures. High School Diploma Preferred/GED 3 Months Experience (Corrugated packaging setting)Manufacturing experience... preferred The Skills You Will Bring Able and willing to perform and sustain productivity goals Comply with all IPs Safety...

Lugar: Ashland City, TN | 07/12/2024 00:12:47 AM | Salario: S/. No Especificado | Empresa: International Paper

Principal Engineer - HBM SOC Design and Integration - TPG

and specification documents, work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed. Review... languages such as Python. Experience with working on one or more of the following IPs: UCIE, Memory Controller, NOCs...

Lugar: Richardson, TX | 06/12/2024 23:12:08 PM | Salario: S/. No Especificado | Empresa: Micron

Specialty Assembler

and procedures. High School Diploma Preferred/GED 3 Months Experience (Corrugated packaging setting)Manufacturing experience... preferred The Skills You Will Bring Able and willing to perform and sustain productivity goals Comply with all IPs Safety...

Lugar: Ashland City, TN | 06/12/2024 18:12:10 PM | Salario: S/. No Especificado | Empresa: International Paper

RF IC - Principal Electrical Engineer

and development of RF LNA and SW IPs for next generation mobile devices using SOI, SiGe and other technologies. The Candidate..., etc Understanding and insight into packaging and modeling A self-starter with a chip lead experience Preferred Qualifications...

Lugar: Irvine, CA | 05/12/2024 22:12:06 PM | Salario: S/. $126500 - 241700 per year | Empresa: Skyworks

Division Sales Manager

About Us: IPSPackaging & Automation is a leading provider of packaging materials and related supplies.... Why Join IPSPackaging & Automation: Military-Friendly: We value the leadership and skills brought by military veterans...

Lugar: Greensboro, NC | 05/12/2024 20:12:21 PM | Salario: S/. $110000 - 140000 per year | Empresa: Nivalmi Consulting

RF IC - Principal Electrical Engineer

and development of RF LNA and SW IPs for next generation mobile devices using SOI, SiGe and other technologies. The Candidate..., etc Understanding and insight into packaging and modeling A self-starter with a chip lead experience Preferred Qualifications...

Lugar: Irvine, CA | 05/12/2024 18:12:11 PM | Salario: S/. $126500 - 241700 per year | Empresa: Skyworks

COPD (Customer Owned Physical Design) Engineer

, and packaging? Have you taped out so many chips that you can identify potential design problems hidden in EDA reports, advise design... programs from inception to finish, including RFQs, legal, technology and IP collaterals, design, test, packaging, fabrication...

Lugar: San Jose, CA | 28/11/2024 23:11:12 PM | Salario: S/. No Especificado | Empresa: Broadcom

SerDes Lead Circuit Design Engineer

, execute and drive state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs...). You will be leading discussions with cross-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create...

Lugar: Cupertino, CA | 24/11/2024 03:11:09 AM | Salario: S/. No Especificado | Empresa: Apple

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Cary, NC | 23/11/2024 02:11:16 AM | Salario: S/. No Especificado | Empresa: Apple

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Waltham, MA | 23/11/2024 00:11:52 AM | Salario: S/. No Especificado | Empresa: Apple