RF IC - Principal Electrical Engineer

and development of RF LNA and SW IPs for next generation mobile devices using SOI, SiGe and other technologies. The Candidate..., etc Understanding and insight into packaging and modeling A self-starter with a chip lead experience Preferred Qualifications...

Lugar: Irvine, CA | 05/12/2024 18:12:37 PM | Salario: S/. $126500 - 241700 per year | Empresa: Skyworks

Senior Custom ASIC Engineering Lead

cross-functional teams in areas such as physical design, STA, DFT, and packaging? Have you taped out so many chips... from inception to finish, including RFQs, technology and IP collaterals, design, test, packaging, fabrication, bring-up...

Lugar: San Jose, CA | 29/11/2024 00:11:17 AM | Salario: S/. No Especificado | Empresa: Broadcom

SerDes Lead Circuit Design Engineer

, execute and drive state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs...). You will be leading discussions with cross-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create...

Lugar: Cupertino, CA | 23/11/2024 20:11:02 PM | Salario: S/. No Especificado | Empresa: Apple

Project Controller (Cost)

Job Description: At IPS, we apply our knowledge, skills, and passion to make a difference in the lives of people... and attends activities at client sites where they work in construction, process, packaging, manufacturing, research, or other "non...

Lugar: Blue Bell, PA | 23/11/2024 03:11:39 AM | Salario: S/. $76000 - 126000 per year | Empresa: Integrated Project Services

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Cary, NC | 23/11/2024 01:11:59 AM | Salario: S/. No Especificado | Empresa: Apple

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Waltham, MA | 22/11/2024 19:11:13 PM | Salario: S/. No Especificado | Empresa: Apple

Principal Digital IC Design Engineer

, specification, design, verification, validation, fabrication, packaging, debugging, test development, failure analysis..., design digital logic blocks using Verilog and SystemVerilog HDL and utilize in-house digital IPs to extend functionality...

Lugar: California | 22/11/2024 00:11:45 AM | Salario: S/. $96000 - 200000 per year | Empresa: Raytheon Technologies

Project Controller (Cost)

where they work in construction, process, packaging, manufacturing, research, or other "non-administrative" areas. IPS...Job Description: Job Description At IPS, we apply our knowledge, skills, and passion to make a difference in the...

Lugar: USA | 22/11/2024 00:11:14 AM | Salario: S/. $76000 - 126000 per year | Empresa: Integrated Project Services

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Waltham, MA | 21/11/2024 18:11:35 PM | Salario: S/. No Especificado | Empresa: Apple

Quality Manager

Job Description: Job Description At IPS, we are global leaders in developing innovative solutions for the... to effectively train, supervise, communicate, execute, and manage the IPS Construction Quality Control and Quality Assurance (QA/QC...

Lugar: Somerset, NJ | 21/11/2024 01:11:02 AM | Salario: S/. No Especificado | Empresa: Integrated Project Services