Principal Engineer - HBM SOC Design and Integration - TPG

and specification documents, work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed. Review... languages such as Python. Experience with working on one or more of the following IPs: UCIE, Memory Controller, NOCs...

Lugar: Richardson, TX | 06/12/2024 18:12:13 PM | Salario: S/. No Especificado | Empresa: Micron

Division Sales Manager

About Us: IPSPackaging & Automation is a leading provider of packaging materials and related supplies.... Why Join IPSPackaging & Automation: Military-Friendly: We value the leadership and skills brought by military veterans...

Lugar: Greensboro, NC | 06/12/2024 01:12:24 AM | Salario: S/. $110000 - 140000 per year | Empresa: Nivalmi Consulting

RF IC - Principal Electrical Engineer

and development of RF LNA and SW IPs for next generation mobile devices using SOI, SiGe and other technologies. The Candidate..., etc Understanding and insight into packaging and modeling A self-starter with a chip lead experience Preferred Qualifications...

Lugar: Irvine, CA | 05/12/2024 18:12:13 PM | Salario: S/. $126500 - 241700 per year | Empresa: Skyworks

RF IC - Principal Electrical Engineer

and development of RF LNA and SW IPs for next generation mobile devices using SOI, SiGe and other technologies. The Candidate..., etc Understanding and insight into packaging and modeling A self-starter with a chip lead experience Preferred Qualifications...

Lugar: Irvine, CA | 05/12/2024 18:12:54 PM | Salario: S/. $126500 - 241700 per year | Empresa: Skyworks

Senior Custom ASIC Engineering Lead

cross-functional teams in areas such as physical design, STA, DFT, and packaging? Have you taped out so many chips... from inception to finish, including RFQs, technology and IP collaterals, design, test, packaging, fabrication, bring-up...

Lugar: San Jose, CA | 29/11/2024 00:11:04 AM | Salario: S/. No Especificado | Empresa: Broadcom

SerDes Lead Circuit Design Engineer

, execute and drive state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs...). You will be leading discussions with cross-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create...

Lugar: Cupertino, CA | 24/11/2024 01:11:38 AM | Salario: S/. No Especificado | Empresa: Apple

Project Controller (Cost)

Job Description: At IPS, we apply our knowledge, skills, and passion to make a difference in the lives of people... and attends activities at client sites where they work in construction, process, packaging, manufacturing, research, or other "non...

Lugar: Blue Bell, PA | 23/11/2024 03:11:59 AM | Salario: S/. $76000 - 126000 per year | Empresa: Integrated Project Services

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Cary, NC | 22/11/2024 22:11:54 PM | Salario: S/. No Especificado | Empresa: Apple

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Waltham, MA | 22/11/2024 21:11:09 PM | Salario: S/. No Especificado | Empresa: Apple

SerDes Circuit Design Engineer

state-of-the-art IPs key to Apple's products. You will be challenged to make the best-in-class designs to surprise... discussions with multi-functional teams (e.g., architecture, SIPI, packaging, board design, DFT, ESD) to create and drive block...

Lugar: Waltham, MA | 22/11/2024 02:11:42 AM | Salario: S/. No Especificado | Empresa: Apple